08.11.2018
Mr Lee Wai Kwong, CEO of ASMPT, third from left, and Mr Wang Jun, Mayor of Tianshui, fourth from left, witnessed the signing of the Letter of Intent between Tianshui Huatian Technology Company Ltd and ASMPT at CIIE.
Shanghai, People’s Republic of China, 8 November 2018 – ASM Pacific Technology Ltd. (ASMPT), the world leader in semiconductor assembly and packaging solutions, equipment and materials, announced it has signed Letters of Intent worth more than US$130 million with two companies under the Tianshui Huatian Electronic Group Co Ltd, (TSHT) at the inaugural China International Import Exhibition (CIIE).
TSHT manufactures and distributes semiconductor devices for the domestic and overseas market. The Letters of Intent were signed on 6 November for the procurement of semiconductor manufacturing and packaging equipment, materials and solutions in the next 24 months for its two companies: Tianshui Huatian Technology Co Ltd and HuaTian Technology (Xi' an) Co., Ltd.
Mr Lee Wai Kwong, CEO of ASMPT signing the Letter of Intent with Mr Wu Shutao, Chief Financial Officer of HuaTian Technology (Xi’an) Co, Ltd. at CIIE.
TSHT is one of the major IC packaging and test enterprises in China and the only listed company of Western China in the packaging industry.
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About ASM Pacific Technology Limited
As a global technology and market leader, ASMPT (HKEX stock code: 0522), develops and provides leading edge solutions and materials for the semiconductor assembly and packaging industries. Its surface mount technology solutions are deployed in a wide range of end-user
markets including electronics, mobile communications, automotive, industrial, LED and alternative energy. The company’s continuous investments in research and development help to provide its customers with innovative and cost-efficient solutions and systems that enable them to achieve
higher productivity, greater reliability and enhanced quality.
Listed on the Hong Kong Stock Exchange since 1989, ASMPT is currently one of the constituent stocks on the Hang Seng Composite MidCap Index under the Hang Seng Composite Size Indexes, the Hang Seng Composite Information Technology Industry
Index under Hang Seng Composite Industry Indexes, the Hang Seng Hong Kong 35 Index and the Hang Seng Global Composite Index. To learn more about ASMPT, please visit its website at www.asmpacific.com.
For further information, please contact:
Strategic Financial Relations Limited
Mandy Go / Antonio Yu / Rachel Ko
Tel: 2864 4812 / 2114 4319 / 2114 2370
Fax: 2527 1196
Email: mandy.go@sprg.com.hk / antonio.yu@sprg.com.hk / rachel.ko@sprg.com.hk
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