Group Structure

Semiconductor Solutions

  • Wire bonders
  • Die bonders
  • Encapsulation solutions
  • Test handlers
  • Clip bonders
  • CIS equipment
  • TCB bonders
  • Flip chip bonders
  • Mold Under Fill (MUF)
  • Panel molding
  • Laser grooving and dicing

SMT Solutions

  • Assembly line solutions
  • DEK printing systems
  • SIPLACE placement systems
  • ASM smart factory tools & services

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