Press releases

ASMPT and KOKUSAI ELECTRIC Join Forces to Accelerate 2.5D and 3D Heterogeneous Integration Technology

Intelligent alternative-component solution from ASMPT and Viscom for Schaeffler AG
Different supplier, same process

ASMPT at SEMICON West 2025 Showcasing Advanced Packaging Solutions for AI and High-Performance Computing

ASMPT Announces Gordon Lam as Chief Commercial Officer for SEMI Solutions
ASMPT Announces Gordon Lam as Chief Commercial Officer for SEMI Solutions

ASMPT Joins "JOINT3" Consortium to Develop Next-Generation Semiconductor Packaging
ASMPT Joins "JOINT3" Consortium to Develop Next-Generation Semiconductor Packaging

ASMPT Introduces ALSI LASER1206 - Fully Automatic Laser Dicing and Grooving

Enabling Chips for AI

WORKS Optimization from ASMPT
Intelligent process optimization along the entire line

Leading-Edge Packaging for Advanced Technologies

ASMPT Announces Strategic Optimisation of its Manufacturing Operations
ASMPT Announces Strategic Optimisation of its Manufacturing Operations

ASMPT Announces 2025 Interim Results Strong Demand Driven By AI Tailwinds
ASMPT Announces 2025 Interim Results Strong Demand Driven By AI Tailwinds

ASMPT presents software duo for seamlessly automated material flow optimization
Maximum uptime with 100-percent transparency

ASMPT at NEPCON Thailand
The Intelligent Factory Showcase

Toni Patzner becomes Global Head of Supply Chain Management at ASMPT SMT Solutions
Focused on lean structures

Humanoid Robots: The Next Frontier in AI and Automation

Spotlight on 2D + 3D Wire Bond Inspections with CamSpector PRO!

Tackling the Challenges of System-In-Package Solutions with MEGA!

WORKS Integration – the data center for intelligent manufacturing
ASMPT presents central platform for data exchange in electronics manufacturing

ASMPT at SEMICON SEA showcases comprehensive advanced packaging expertise

ASMPT Semiconductor Solutions at PCIM

ASMPT Announces 2025 First Quarter Results
ASMPT Announces 2025 First Quarter Results

Introducing the Enhanced AERO PRO XPOWER 2.0!

ASMPT demonstrates technology leadership in SMT assembly
Zero DPMO – in every dimension

Innovative Solution for Radio Frequency Packaging: MEGA with Silver Sintering Paste!

Introducing the CamSpector PRO: Revolutionizing CMOS Image Sensor Packaging with Advanced FM Inspection

Dr. Thomas Marktscheffel of ASMPT honored for his work on open interfaces
IPC President's Award

Introducing XPOWER 2.0: Revolutionizing Wire Bonding in Semiconductor Manufacturing!

New stationary camera for SIPLACE placement machines
Fast, flexible, high-resolution

New Managing Director at ASMPT SMT Solutions for the Asia region (excluding China)
DaeSung Kim takes over Sales and Service Organization

Great Success at SEMICON Korea 2025

ASMPT at SEMICON Korea 2025

ASMPT at IPC APEX EXPO 2025
Component flexibility from the technology leader

ASMPT Announces 2024 Annual Results
ASMPT Announces 2024 Annual Results

Introducing Our Latest Innovation: The Next-Gen Wire Bonder!

Techman Robot and ASMPT Sign MOU to Accelerate Intelligent Manufacturing Innovations

PCBs trigger program downloads on the SMT line
Seamless program changeovers – now also across setups

Katie Xu Promoted to Executive Vice President, Strengthening ASMPT’s Financial Leadership
Katie Xu Promoted to Executive Vice President, Strengthening ASMPT’s Financial Leadership

ASMPT Announces 2024 Third Quarter Results
ASMPT Announces 2024 Third Quarter Results
![[Singapore, August 09, 2024] – ASMPT Limited (HKEX stock code: 0522), the world’s leading maker of integrated solutions for the manufacture of semiconductors and electronics, was recently honoured with the 2023 Supplier Excellence Award from Texas Instruments (TI) for the second year running. This prestigious recognition underscores ASMPT ASMPT Wins Exclusive Texas Instruments Supplier Excellence Award for Second Year Running](http://d2o7emhzwey5ns.cloudfront.net/assets/files/75417/asmpt_ti_sea_award_2023-1.png)
ASMPT Wins Exclusive Texas Instruments Supplier Excellence Award for Second Year Running
ASMPT Wins Exclusive Texas Instruments Supplier Excellence Award for Second Year Running

ASMPT Announces 2024 Interim Results Advanced Packaging: Strong Order Momentum
ASMPT Announces 2024 Interim Results

ASMPT and IBM Deepen Collaboration to Advance Bonding Methods for Chiplet Packages for AI
ASMPT and IBM Deepen Collaboration to Advance Bonding Methods for Chiplet Packages for AI

ASMPT Announces 2024 First Quarter Results Book-to-Bill Ratio Above One QoQ Bookings Growth Driven by Advanced Packaging
ASMPT Announces 2024 First Quarter Results

ASMPT Announces 2023 Annual Results Solid Performance for Advanced Packaging
ASMPT Announces 2023 Annual Results

ASMPT Announces 2023 Third Quarter Results Advanced Packaging A Bright Spot Amidst Weak Industry Conditions
ASMPT Announces 2023 Third Quarter Results

ASMPT Announces 2023 Interim Results Q2 2023 Revenue Above Mid-point of Guidance Positioned Well for Generative AI and HPC Growth
ASMPT Announces 2023 Interim Results

ASMPT Announces 2023 First Quarter Results Q1 2023 Revenue Above Mid-point of Guidance Despite Challenging Macro Environment
ASMPT Announces 2023 First Quarter Results

ASMPT announces key global and SMT leadership changes to prepare it for the future
ASMPT announces key global and SMT leadership changes to prepare it for the future

ASMPT announces key SEMI Solutions Segment leadership changes to prepare it for the future
ASMPT announces key SEMI Solutions Segment leadership changes to prepare it for the future

ASMPT Announces 2022 Annual Results: Q4 2022 Revenue Above Guidance, 7th Consecutive Quarter of Gross Margin above 40%
ASMPT Q4 2022 Results Announcement