ASMPT at SEMICON SEA showcases comprehensive advanced packaging expertise

The demand for more sophisticated packaging technologies is growing swiftly, driven by key applications such as high-performance computing, 5G and 6G telecommunications, modern automotive systems, and the rapidly increasing adoption of artificial intelligence. High-performance packaging capabilities are crucial to realise higher integration densities, increased energy efficiency, and reliable system performance.

Comprehensive portfolio for the entire AP spectrum

ASMPT's broad-based AP solutions portfolio covers all key technologies crucial for current and future requirements in AP. These include fan-out wafer level packaging (FOWLP), flip-chip interconnection, thermo-compression bonding (TCB), hybrid bonding, system-in-package (SiP), die attach for power devices and solutions for heterogeneous integration.

In addition to AP, ASMPT’s mainstream solutions portfolio includes high-end wire bonding technologies for high-frequency and automotive applications, highly automated packaging and material handling systems, as well as technologies for photonics and optical interconnect packaging, which are becoming increasingly important, particularly in meeting future high-speed and high-density requirements.

ASMPT’s solutions make it possible for customers to reliably fulfil demanding requirements for miniaturisation, signal and power integrity as well as thermal management, even at the highest power densities.

Singapore as a strategic innovation centre for advanced packaging

As part of a global development and production network, ASMPT’s state-of-the-art facility in Singapore plays a central role as an innovation and competence centre for AP. In addition to working closely with customers and partners in the global network, ASMPT continues to make strategic investments to expand its technological expertise and develop a strong talent pool of highly qualified engineers and technology specialists in Singapore. The combination of global expertise, global networking and knowledge sharing, and direct local market access creates the ideal conditions for fast implementation of new packaging concepts and for successfully meeting the growing requirements in the key markets for advanced packaging.

Strong partner in a dynamic environment

Customers worldwide rely on trustworthy partnerships especially in times of great global challenges and increasing demands on supply chain resilience”, explains Dr Gary Widdowson, Chief Technology Officer at ASMPT Semiconductor Solutions. “ASMPT is clearly positioning itself in Singapore as a reliable and stable technology partner whose solutions contribute to technological resilience with its solutions, especially in Asia and Europe.

As part of the ‘Advanced Packaging & Heterogeneous Integration Summit’, Dr Widdowson will give a presentation entitled ‘ASMPT AP Technology for HI’ on 21 May 2025.

By taking part in SEMICON SEA, the region’s leading platform for the semiconductor and microelectronics industry, ASMPT underlines its key role in the field of AP - as a driver of innovation, a trusted partner and an enabler for the next generation of electronic systems.

ASMPT SEMI Solutions