According to Goldman Sachs, the global market for humanoid robots could reach $38 billion by 2035, a sixfold increase from earlier projections
This surge is fueled by
- Rapid AI advancements, including robotic LLMs and self-learning models
- Massive investments from tech giants
At ASMPT, we see humanoid robots as systems of systems—packed with sensors, actuators, edge AI chips, and high-bandwidth interconnects. This complexity demands cutting-edge packaging solutions: from mainstream package to advanced packaging. Technologies involve chiplets and 3D integration to thermal management and miniaturization.
Whether it’s eldercare, logistics, or industrial automation, humanoid robots are poised to become the smartphones of the AI era—ubiquitous, intelligent, and indispensable.
Let’s lead the way in enabling this future—one package at a time.
ASMPT SEMI Solutions
Other news
- Different supplier, same process
- Lead the Edge: ASMPT Enabling the AI World
- Lead the Edge: ASMPT Enabling the AI World
- Focus on automotive power electronics
- Empower the Intelligence Revolution
- ASMPT exhibits at SEMICON India 2025 - Leading-Edge Packaging for Advanced Technologies
- ASMPT exhibits at SEMICON Taiwan 2025 - Enabling Chips for AI
- ASMPT Introduces ALSI LASER1206 - Fully Automatic Laser Dicing and Grooving
- Techman Robot and ASMPT Sign MOU to Accelerate Intelligent Manufacturing Innovations
- Introducing Our Latest Innovation: The Next-Gen Wire Bonder!