What’s New in XPOWER 2.0?
Optimized Bonding Precision
- Our upgraded hardware and software deliver unparalleled accuracy and productivity for all wire bonding applications.
Smart Process Automation
- Experience seamless automation that adapts to your production needs, improving efficiency and output.
Elevate your manufacturing capabilities with the power of AERO PRO XPOWER 2.0!
Discover more about the latest features XPOWER 2.0 and how it can elevate your production processes.
ASMPT SEMI Solutions
Other news
- Different supplier, same process
- Lead the Edge: ASMPT Enabling the AI World
- Lead the Edge: ASMPT Enabling the AI World
- Focus on automotive power electronics
- Empower the Intelligence Revolution
- ASMPT exhibits at SEMICON India 2025 - Leading-Edge Packaging for Advanced Technologies
- ASMPT exhibits at SEMICON Taiwan 2025 - Enabling Chips for AI
- ASMPT Introduces ALSI LASER1206 - Fully Automatic Laser Dicing and Grooving
- Techman Robot and ASMPT Sign MOU to Accelerate Intelligent Manufacturing Innovations
- Introducing Our Latest Innovation: The Next-Gen Wire Bonder!