AFC Plus - Die Bonder and Flip Chip Bonder
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CoS Die Bonder: High-precision chip-on-substrate bonding
ASM AMICRA's fully automatic, die bonder / flip chip bonder with exceptionally high precision and placement accuracy (±1.5µm), a cycle time of <15 sec. as well as a modular machine concept, a flip chip option and much more.
Nova Plus - Die Bonder and Flip Chip Bonder
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NANO - Die Bonder and Flip Chip Bonder
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