NEW SIPLACE V
A new Era begins in SMT Manufacturing
Performance Booster for the Intelligent Factory – Perfection in the High-speed Range
The SIPLACE V platform delivers a performance boost of up to 30 % and combines maximum speed with maximum flexibility. With this completely newly developed placement platform, ASMPT is setting new standards in electronics manufacturing. SIPLACE V combines maximum productivity, flexibility and quality in a very compact footprint. It offers full compatibility with existing ASMPT solutions and superior performance reserves for automation and AI integration.
A New Era in SMT High-speed Production Lines
- Real Performance Boost in Key Industries
The SIPLACE V placement platform features an innovative machine frame as well as highly efficient linear drives and measuring systems with increased resolution. This enables it to achieve performance increases of up to 30 % in key industries for the electronics industry, such as automotive, consumer, smartphones, IT and network infrastructure – under real production conditions. - Optimized Placement Heads
The placement heads can now be changed during operation via a central head interface. With the improved heads, the SIPLACE V can now place up to 52,500 components per hour with a precision of 25 µm @ 3 σ (placement head CP20), switch between collect-and-place, pick-and-place and mixed modes via software (CPP placement head) and reliably process components up to a size of 200 × 150 × 28 millimetres with up to 100 Newton and maximum precision (TWIN VHF placement head). - Flexibility for High-speed Applications
The SIPLACE V platform handles the entire spectrum of components – from ultra-small 016008M chips to large-format components – and demonstrates its strengths particularly when processing demanding or unusually shaped odd-shaped components (OSCs). The machines are available in either single or dual gantry versions and can be configured with single or dual conveyors. - Proven Quality – Resolutely Advanced
The SIPLACE V incorporates the proven quality features of the SIPLACE platforms and has been consistently further developed. Features such as the individually rotatable nozzle segments, which are unique in the industry, individual component inspection and complete traceability are part of the placement machine, supplemented by high-resolution cameras for even greater precision. - Investment Security through Complete Compatibility
The new SIPLACE V platform fits seamlessly into the ASMPT SMT Solutions portfolio. Existing hardware components such as feeders and cameras can continue to be used without restriction, as can all applications from the comprehensive ASMPT software world – from station software to the applications of the WORKS Software Suite and Factory Solutions. - Future-proof Investment
Like all ASMPT placement machines, the SIPLACE V operates within the data network of intelligent manufacturing. Standardized interfaces and Ethernet-based internal machine communication ensure maximum bandwidth and universal connectivity. The innovative platform has plenty of performance reserves for future automation steps and AI integration.
Launch into the future of electronics manufacturing
In times of rapid technological change and increasing demands, the SIPLACE V means that electronics manufacturers can respond more quickly to market demands, make their production more stable and sustainable, and secure competitive advantages in the key markets of the future today.
The new SIPLACE V platform from ASMPT takes intelligent factories to a new level. The sophisticated and revolutionary machine concept sets new benchmarks in performance, flexibility, quality, compatibility and future-readiness.