NEW: ALSI LASER1206
Modular Laser Dicing Solution
Powering the future of Advanced Packaging & Power Automotive applications
The new cutting-edge multi-beam laser dicing platform addresses the growing demand from semiconductor companies specializing in advanced packaging to deliver solutions for growth markets such as AI and smart mobility. This new system, featuring patented multi-beam laser processing technology, with fully automated film frame and bare wafer handling, expands the company's portfolio with a focus on front-end processes.
Fully Automated Laser Dicing & Grooving Solution
The next-generation LASER platform has been specifically engineered to meet the increasingly complex requirements of IDM and Foundry semiconductor companies for laser dicing and grooving of wafers. This innovative system delivers precision and performance that is unparalleled in the industry, enabling processing of a wide range of semiconductor materials used in Advanced Memory, Logic, AI and Power applications.
The patented UV laser technology achieves maximum precision with minimal heat impact, thereby reducing burr formation and die strength degradation. The device has an integrated wafer coating and cleaning station and offers numerous options for fully automated handling of film frames and bare wafers. The positioning accuracy of the planar motion system is < 1.5 μm. For grooving, wafers from 60 to 800 μm can be processed, while for dicing, the wafer thickness ranges from 20 to 200 μm.
Precision Without Compromise
- Fully automated, picks up the wafer from the FOUP and transfers it to platform automatically
- Laser Dicing/Grooving wafer materials with ASMPT‘s patented multi-beam technology
- Precision with minimal thermal impact: limited local heat load offers best possible process quality & high die strength
- Integrated wafer coating & cleaning station and coating drying station
- Film Frame / Bare wafer handling options
- Mini Class 1000 environment: closed doors between every process module
- Compliant with all relevant industry standards like CE/UKCA, NFPA, SEMI-S2/S8, EMC and FDA
Laser Technology for the Next Era of AI, Automotive and Mobile Innovation
The new platform is our contribution to the hardware needs of the AI revolution. It combines high-precision laser processing with intelligent automation to support the next generation of semiconductor manufacturing. It is the ideal platform for applications in advanced packaging, AI, and power automotive and mobile applications.
ALSI LASER1206 is the solution for preparing plasma dicing with maximum yield.