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Multisize Placement

Ready for AI, HPC, and Next-Gen Server Applications

Placement of Large, Heavy and Complex BGAs

As electronic components become increasingly diverse, the ability to precisely and reliably place large, heavy, and high-value BGAs (Ball Grid Arrays) is becoming mission-critical. From the rise of AI applications to the complexity of high-performance server boards, the challenges posed by oversized and irregularly shaped components are growing rapidly. ASMPT is setting new benchmarks in advanced SMT placement with pioneering technologies that redefine what's possible in multisize placement.

Future-Proof Placement Technology

Multisize placement is not just about accommodating larger components – it's about mastering complexity. ASMPT delivers precision, flexibility, and reliability for the placement of today's most challenging components.

With SIPLACE SX and TWIN Very High Force placement heads, electronics manufacturers are ready for AI, High Performance Computing, and next-gen server applications — no matter the size or weight of the components.

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