Placement of Large, Heavy and Complex BGAs
As electronic components become increasingly diverse, the ability to precisely and reliably place large, heavy, and high-value BGAs (Ball Grid Arrays) is becoming mission-critical. From the rise of AI applications to the complexity of high-performance server boards, the challenges posed by oversized and irregularly shaped components are growing rapidly. ASMPT is setting new benchmarks in advanced SMT placement with pioneering technologies that redefine what's possible in multisize placement.
Unlocking the Challenges of Large and Heavy BGAs
Modern processors and AI components can measure up to 150 x 150 mm, weight up to 500 grams, and carry more than 20,000 connections. These extreme specifications demand an unprecedented level of precision and process control in SMT placement. ASMPT's SIPLACE placement systems are engineered to meet these challenges head-on, combining mechanical stability with intelligent software and powerful inspection tools.
- Smart Component Description for Complex Structures
Handling components with irregular ball configurations begins with intelligent programming. ASMPT offers two powerful approaches: a teaching wizard with Multiple Field of View (MFOV) imaging and the option to import x/y coordinate data directly from suppliers. These tools ensure accurate recognition of ball patterns and prevent false rejections of functional components. - Specialized Nozzle Design and Pickup Assurance
Large, fragile BGAs require custom nozzles adapted to their surfaces and weight distribution. SIPLACE machines scan and verify nozzle and tray positions in real time. - Force-Controlled Placement with Inertia Compensation
Rotational movements of heavy components require precise control. SIPLACE systems determine the component's mass moment of inertia to optimize acceleration and deceleration across all axes. This ensures correct placement and avoids shifts during rotation. - Advanced Vision and Coplanarity Inspection
Standard component cameras are insufficient for verifying the coplanarity of high-density BGAs. ASMPT deploys laser-based 3D coplanarity systems with sub-micron resolution, compliant with JEDEC standards, to ensure every connection lands flat and defect-free. - Onboard PCB Inspection and Spacer Verification
To ensure the correct placement of large BGAs, SIPLACE systems also inspect PCB surfaces before component placement. This includes inspection of spacers, solder paste volumes, and foreign object detection before the valuable large BGA is placed.
Future-Proof Placement Technology
Multisize placement is not just about accommodating larger components – it's about mastering complexity. ASMPT delivers precision, flexibility, and reliability for the placement of today's most challenging components.
With SIPLACE SX and TWIN Very High Force placement heads, electronics manufacturers are ready for AI, High Performance Computing, and next-gen server applications — no matter the size or weight of the components.