AMICRA NANO: Hybrid Bonding for Data Highways

The high-precision AMICRA NANO die and flipchip bonder was specially designed for the production of co-packaged optics that integrate optical and electronic components in a shared housing. With the highest precision and exceptional process stability, it is ideal for the requirements of modern data transmission technologies. Co-packaging optics makes it possible to produce compact yet powerful components for data centres, which require energy-efficient and speedy data communication with minimal latencies.

The innovative bonding technology in the AMICRA NANO does not require soldering or gluing but employs atomic diffusion to ensure stable mechanical and electrical connections. While this technology enables strong miniaturisation, it requires maximum precision as the components no longer centre themselves during heat treatment. With a placement accuracy of ±0.2 μm and bonding forces ranging from 0.1 to 20 N, the machine achieves a throughput rating of 200 to 400 components per hour, which is ideal for high-mix/low-volume applications such as chiplets, prototypes and new process studies.

In the future, hybrid bonding will be crucial for maximum performance in the smallest of spaces, as required by high-performance computers, quantum computers, and AI systems. With its co-packaged optics production technology, ASMPT is making a contribution to the energy efficiency of modern data centres, which are among the world’s greatest users of energy. Integrating optical and electronic components in the smallest of spaces helps to reduce energy consumption by shortening electrical signal paths. This in turn reduces the environmental impact and contributes to the development of sustainable technologies.