Automated Paste Transfer for More Efficient Solder Paste Utilisation

The Paste Transfer Unit for the DEK TQ platform optimises the changeover process in solder paste printing by automatically transferring residual paste to the new stencil, thus cutting down on paste waste. The automated system ensures precise and clean paste transfers, replacing the often inaccurate and lossy manual step of moving paste with a spatula. It also minimises contamination and ensures even distribution, which reduces the risk of short circuits and malfunctions.

Automating this operation allows electronics manufacturers to significantly reduce the amount of discarded paste, which is considered hazardous waste. Compared to the manual method, which leaves up to 10% of the paste on the stencil, the automated transfer reduces this loss to a mere 5%. This saves on costs and reduces the material consumption, which in turn reduces the manufacturing costs per board. It also eliminates the need for manual assists, which minimises process variations and raises the production yield. The consistent and automated execution of this step leads to more stable and efficient processes. The new system can be easily retrofitted, allowing electronics manufacturers to significantly improve their sustainability and cost-effectiveness.