Closer Cooperation with IBM to Further Advance the Development of Chiplet Packaging Technologies for AI

ASMPT and IBM have further expanded their partnership in the development of advanced chiplet packaging technologies in 2024. The project focuses on advancing thermo-compression and hybrid bonding methods for chip packages with ASMPT’s state-of-the-art FIREBIRD TCB and LITHOBOLT hybrid bonding machines.

Chiplet technology allows system-on-chips to be broken down into smaller, specialised chips that work together as an integrated system. This architecture offers potential benefits such as improved energy efficiency, short development cycles, and lower manufacturing costs. The goal is to develop advanced bonding processes in order to efficiently transfer chiplet packaging technologies from research to mass production, especially in view of the rapid development of the computing power of artificial intelligence.

The new agreement builds on an existing collaboration that has already led to the introduction of an improved hybrid bonding approach. ASMPT and IBM will now work jointly on developing the next generation of chip bonding technologies to better meet the demands of the AI era. The partnership intends to make the even faster and more efficient production of more powerful and compact chips possible.