LITHOBOLTTM G2: Precision Meets Sustainability
The LITHOBOLT G2 is a fully automated high-precision chip-to-wafer machine specifically designed for handling 12-inch wafers in ultraclean environments (Class 1, ISO 3). Thanks to its versatility, it can handle a wide range of die sizes and wafer substrates in both face-up and face-down applications and can be seamlessly integrated into a production line to ensure high bonding quality.
The LITHOBOLT G2 also sets standards in terms of environmental compatibility with its hybrid bonding process that uses neither solder nor flux, making it particularly environmentally friendly. Direct copper-copper connections reduce electrical resistance and energy consumption. This makes it possible to build advanced 3D device stacks with greater I/O and memory densities and contributes to more energy-efficient semiconductor devices. Despite its compact design, the LITHOBOLT G2 processes a high number of units per hour. Its smaller footprint combined with increased productivity reduces its operating costs and improves the energy and resource efficiency of the production equipment.
The fully automatic line integration of the LITHOBOLT G2 minimises material waste, ensures consistent quality, and reduces the error rate caused by human intervention. This increases the production stability while ensuring a safer working environment and reducing the risk of accidents.
The LITHOBOLT G2 combines technological innovation with sustainable principles – a major step towards environmentally friendly and efficient semiconductor production.