SIPLACE CA: Reducing Waste through High-Tech Innovations

With the SIPLACE CA2 hybrid placement solution, ASMPT is setting new standards in resource consumption and waste reduction. By combining high-speed die attach directly from the singulated wafer and SMT placement in a single unit, the machine makes it possible to seamlessly integrate the production of SiPs into the SMT line. The SIPLACE CA2 is capable of processing up to 50,000 dies or 76,000 SMT component per hour with a precision of up to 10 μm @ 3 σ.

One of the greatest advantages of this technology is the drastic reduction of tape waste because it completely eliminates the die taping step, which means that a 24/7 production can save up to 800 kilometres of tape per year – a significant improvement that does not just reduce costs but also reduces the burden on the environment. Eliminating the taping material reduces the material consumption as well as disposal and storage costs. In a high-volume production, for example of smartphones or tablets, this creates savings in the millions and lowers the environmental footprint considerably.

In addition to avoiding waste, the SIPLACE CA2 scores with intelligent process optimisation and lower power consumption through less scrap. A buffer system delivers more performance by uncoupling the die pickup from the wafer from its placement on the substrate. And thanks to its flexible wafer change technology, the machine conserves space on the shop floor that can be used otherwise, for example for automated storage and transport systems.

Open standards such as SECS/GEM and IPC-2591 CFX enable seamless data communication that supports ASMPT’s Intelligent Factory concept. This makes the SIPLACE CA2 more than a guarantor of maximum flexibility and efficiency – it is also an important step towards more sustainable electronics production that avoids waste and conserves valuable resources.