ALSI LASER1206 – Precision and Automation for the Semiconductor Industry

he new ALSI LASER1206 marks a new benchmark in precision laser dicing and grooving. Designed for Class 1000 cleanroom operation, it combines patented multi-beam UV laser technology with fully automated wafer handling to deliver exceptional accuracy, throughput and process stability for advanced packaging applications.

Developed for the needs of IDM and foundry customers, the platform processes a wide range of wafer materials used in AI, power, logic and memory devices. Its laser design achieves maximum precision with minimal thermal impact. With < 1.5 μm motion accuracy and flexible wafer-thickness capability from 20 μm to 800 μm, the LASER1206 delivers unmatched versatility. Automated film-frame and wafer handling minimise operator intervention, ensuring safe, efficient and repeatable production.

Combining precision engineering and intelligent automation, the ALSI LASER1206 enables high-yield front-end processing for emerging markets such as AI and smart mobility, contributing to resource efficiency, process reliability and sustainable growth in semiconductor manufacturing.