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50 Years of ASMPT
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News & Events
Bassel Haddad Assumes Leadership of ASMPT as Group Chief Executive Officer
ASMPT Announces 2026 Interim Results Multiple Advanced Packaging Solutions Drive Strong Performance
ASMPT Secures Significant Wins for More than 50 Chip-to-Substrate Thermo-Compression Bonding Tools
ASMPT Announces 2026 First Quarter Results Strong Demand Driven by AI
ASMPT Announces 2025 Annual Results AI-Driven Structural Growth Underpins Group Performance
ASMPT Extends Technology Leadership With Key TCB AOR Chip-To-Wafer Milestone
ASMPT Announces Assessment of Strategic Options for SMT Solutions Segment
ASMPT Secures Additional Orders for Fifteen Chip-to-Substrate Thermo-Compression Bonding Tools Driven by AI Tailwind
ASMPT Wins New Orders for Nineteen Chip-to-Substrate TCB Tools to Serve AI Chip Market
ASMPT Announces 2025 Third Quarter Results Strong Momentum Driven by AI
ASMPT Announces Gordon Lam as Chief Commercial Officer for SEMI Solutions
ASMPT Announces Strategic Optimisation of its Manufacturing Operations
ASMPT Announces 2025 Interim Results Strong Demand Driven By AI Tailwinds
ASMPT Announces 2025 First Quarter Results
ASMPT Announces 2024 Annual Results Advanced Packaging Continues To Benefit From AI Adoption TCB Achieved Record Bookings and Revenue
Katie Xu Promoted to Executive Vice President, Strengthening ASMPT’s Financial Leadership
ASMPT Announces 2024 Third Quarter Results TCB Momentum For HBM Intensifies
ASMPT Wins Exclusive Texas Instruments Supplier Excellence Award for Second Year Running
ASMPT Announces 2024 Interim Results Advanced Packaging: Strong Order Momentum
ASMPT and IBM Deepen Collaboration to Advance Bonding Methods for Chiplet Packages for AI
ASMPT Announces 2023 First Quarter Results Q1 2023 Revenue Above Mid-point of Guidance Despite Challenging Macro Environment
ASMPT Announces 2024 First Quarter Results Book-to-Bill Ratio Above One QoQ Bookings Growth Driven by Advanced Packaging
ASMPT Announces 2023 Interim Results Q2 2023 Revenue Above Mid-point of Guidance Positioned Well for Generative AI and HPC Growth
ASMPT Announces 2023 Third Quarter Results Advanced Packaging A Bright Spot Amidst Weak Industry Conditions
ASMPT Announces 2023 Annual Results Solid Performance for Advanced Packaging
ASMPT announces key global and SMT leadership changes to prepare it for the future
ASMPT announces key SEMI Solutions Segment leadership changes to prepare it for the future
ASMPT Announces 2022 Annual Results: Q4 2022 Revenue Above Guidance, 7th Consecutive Quarter of Gross Margin above 40%
ASMPT Group CEO Robin Ng opens industry first joint customer advocacy center for Semiconductor and Electronics Manufacturing in Vietnam
ASMPT 9-Month & Third Quarter 2022 Results: Resilient 9-Month Revenue & Gross Margin Performance Anchored By Unique Broad-Based Portfolio
ASMPT Marks Latest Milestone with Global Rebrand
ASMPT Announces 2022 Interim Results | Strong 1H 2022 Gross Margin Performance 10.1% YoY Revenue Growth To US$1.34 Billion
ASM Pacific Technology Announces Robust 2022 First Quarter Results | Strong Bookings Of US$902.6 Million (+34.2% QoQ) Underpinned By Advanced Packaging And Automotive
ASTRI, ASM Pacific Technology And Alpha Power Solutions Develop First ‘Made In Hong Kong’ Silicon Carbide Intelligent Power Module For Electric Vehicles
ASM Pacific Technology Announces Record 2021 Annual Results | Record FY2021 EPS HK$7.72 Beats Market Consensus Strategic Initiatives Underpin Long Term Performance
ASMPT Completes Acquisition of Automation Engineering Inc (AEi)
ASM Pacific Technology Reports Robust Nine-Month & Third Quarter 2021 Results | Record Bookings, Revenue and Net Profit for 9M 2021; Bode Well for Full Year 2021 Performance
ASMPT Announces Agreement To Acquire AEi, The Global Automotive Market Leader In Automated Sensor Assembly And Test Equipment
ASM Pacific Technology Announces 2021 Interim Results | Q2 2021 Revenue Exceeds Guidance; Bookings Better Than Expected
ASM Pacific Technology Extends Investment In IoTech, A Flexible Ultra-Fast 3D Printing Start-Up
ASM AMICRA Unveils Industry’s First Manufacturing Systems Incorporating X-Celeprint’s MTP Technology For High Volume Heterogeneous Integration Of Ultra-Thin Chips
ASMPT Announces 2021 First Quarter Results | Record Bookings of US$1.01 Billion in Q1 2021 Backed By Broad-Based Demand
ASM Pacific Technology Reaches Milestone With 250th Thermo-Compression Bonding Tool Shipped To Customers
ASM Pacific Technology Announces 2020 Annual Results | Poised For Strong Recovery Q4 2020 YoY 46.3% Bookings Growth
ASM Pacific Technology and EV Group Join Forces to Enable Industry’s First Ultra Precision Die-to-Wafer Hybrid Bonding Solutions for 3D-IC Heterogeneous Integration
ASMPT Announces 2020 Third Quarter Results | Revenue, Bookings And Profitability For First Nine Months Of 2020 Show Year-On-Year Improvement
ASMPT Announces 2020 Interim Results | Staying Resilient Amid Economic Uncertainty 1H 2020 Group Profitability Improved Year-On-Year
ASMPT Announces Strategic Joint Venture To Accelerate Its Materials Business | Charting A Bright Course For The Future
ASMPT Collaborates With IBM Research On AI Chip Technology
Renaming Of Business Segment
ASMPT Announces 2020 First Quarter Results | Grasping Opportunities In Crises, Forging Ahead
[Clarification Statement] ASM Pacific Technology
ASMPT CEO Named '"Industrialist Of The Year” At Federation Of Hong Kong Industries’ Awards 2019
ASMPT Signed Letters Of Intent Worth Over US$300 Million At CIIE
ASM Technology Singapore Clinched Singapore Quality Award 2019 For Business Excellence
ASM Pacific Technology Announces Retirement Of Mr Lee Wai Kwong And Appointment Of Mr Robin Gerard Ng Cher Tat As Chief Executive Officer Effective May 2020
ASM Pacific Technology Experts Discuss Enabling Technologies For Industry 4.0 At SEMICON Taiwan (17 – 20 September 2019)
ASMPT Clinched Grand Award Of The 2019 HKMA Quality Award
ASM Pacific Technology Celebrates Opening Of New Hong Kong Office At Tsing Yi
ASMPT And Jiujiang Municipal Government Signs Agreement To Build Semiconductor Materials Plant In Jiujiang Economic And Technological Development Zone
ASMPT And Tianshui Huatian Electronic Group Signed Letters Of Intent Worth Over US$130 Million At CIIE
ASMPT Well-Positioned To Leverage High Growth Of Advanced Semiconductor Packaging With NEXX Purchase
ASMPT To Invest In SMART Factory Software Solutions
ASM Pacific Technology Earns Triple Crown For The Second Year
ASM Pacific Technology Expands Its Product Portfolio In Advanced Packaging With New Acquisition
ASM Pacific Technology Acquires Amicra To Enter The Photonics Market
ASM Pacific Technology Recognized As 2018 Thomson Reuters Top 100 Global Technology Leaders
ASM Pacific Technology Invests In Its Future With The Opening Of Its R&D Center In Taiwan
ASM Pacific Technology Celebrates Third Time Win In Technological Achievement
ASM Pacific Technology Won The “Directors Of The Year Awards 2017”
ASM Pacific Technology Named “Hong Kong Outstanding Enterprise”
New Alliance Between Machine Building And IT For Industries 4.0
ASMPT Celebrates Double Win In The “Best Investor Relations Company” And “Asia’s Best CEO (Investor Relations)”Awards
ASMPT Has Once Again Ranked Among The 10 Best Semiconductor Equipment Suppliers
ASM Pacific Technology Honored 2 Best Supplier Awards For Its Excellence Performance And Long-Standing Partnership
ASM Pacific Technology Opens Second Building And New Innovation Centre
ASMPT Ranked Among The Top 5 In VLSI Customer Satisfaction Survey 2016
ASMPT Recognised For Excellence
ASMPT Awarded The 2015 Supplier Excellence Award
ASMPT Brings Broad Portfolio Of Wafer Level / Panel Level Packaging Capabilities To The Advanced Packaging Marketplace
ASMPT Wins the 2015 Hong Kong Awards for Industries: Technological Achievement Grand Award
ASMPT Celebrates 40 Years Of Innovation
ASMPT And SPIL Announce Joint Investment Venture In Molded Interconnect Substrates (“MIS”)
ASM Pacific Technology Is Ranked As The No. 1 Top Assembly Equipment Supplier In 2014 And Earns The Coveted “10 BEST FOCUSED SUPPLIERS OF CHIP MAKING EQUIPMENT” In 2015 As Well As “THE BEST SUPPLIERS OF 2015” Award Once Again
ASMPT, Kaynes Semicon and Perceptives Solutions
Co-Presentation Of A White Paper With The World’s Leading IDM On Thermo Compression Bonding (TCB) At SEMICON Taiwan
DEK Acquisition To Take SMT Business To A Higher Ground
ASM Pacific Technology (ASMPT) Wins The Coveted “10 BEST” Award And Ranks Among The “Best Suppliers Of 2014” Presented By Vlsiresearch; Achieves “Asia’s Best Companies 2014” Recognition From Financeasia
ASMPT To Acquire Screen Printer Specialist DEK ; SIPLACE And DEK To Become One Team
The Development Of STJ Plant
ASM Response To The Coverage On The Staff Suicide In Shenzhen Factory
ASM Pacific Technology Concludes Acquisition Of The Siemens Electronics Assembly System (SEAS) Business
Back
Press Releases
ASMPT Secures Repeat Chip-to-Wafer TCB Orders from Leading Logic Semiconductor Manufacturer
ASMPT Forms Technical Advisory Council to Accelerate AI‑Era Innovation
Closed-loop nozzle management in SMT manufacturing
ASMPT at SEMICON Southeast Asia 2026
ASMPT Receives 2026 Intel EPIC Supplier Award
More transparency and accuracy in SMT production
ASMPT SMT Solutions continues to expand its sales and service organization in the U.S. market
ASMPT looking back on a successful APEX EXPO 2026
Active Stencil Storage von ASMPT
Innovative bonding technologies for AI and electromobility
ASMPT Unveiling Packaging Solutions Enabling the AI World
ASMPT Joins "JOINT3" Consortium to Develop Next-Generation Semiconductor Packaging
Awarded Commitment to Excellent Customer Service
ASMPT at OFC 2026 Los Angeles - Enabling scalable co-packaged optics and photonic integration
ASMPT at SEMICON Korea 2026 Advanced Assembly & Packaging – Empower the Intelligence Revolution
ASMPT SEMI Solutions exhibits at NEPCON Japan
ASMPT Secures Additional Orders for Fifteen Chip-to-Substrate Thermo-Compression Bonding Tools Driven by AI Tailwind
Mastering OSCs for maximum competitive advantage
Strong partnership for innovative Advanced Packaging technologies
A new era: The SIPLACE V platform
We boost your intelligent factory
New analytics functions in SMT Analytics from ASMPT SMT Solutions
ASMPT Wins New Orders for Nineteen Chip-to-Substrate TCB Tools to Serve AI Chip Market
Leading-Edge Packaging for Advanced Technologies
Beginning of a new era: ASMPT takes off
ASMPT at Productronica 2025
Transform your SMT production with ASMPT
Digital services centrally bundled for intelligent manufacturing
Different supplier, same process
Lead the Edge: ASMPT Enabling the AI World
Lead the Edge: ASMPT Enabling the AI World
Focus on automotive power electronics
Empower the Intelligence Revolution
ASMPT exhibits at SEMICON India 2025
ASMPT exhibits at SEMICON Taiwan 2025 - Enabling Chips for AI
ASMPT Introduces ALSI LASER1206 - Fully Automatic Laser Dicing and Grooving
Techman Robot and ASMPT Sign MOU to Accelerate Intelligent Manufacturing Innovations
ASMPT Strengthens its Global Footprint
ASMPT and KOKUSAI ELECTRIC Join Forces to Accelerate 2.5D and 3D Heterogeneous Integration Technology
Seamless program changeovers – now also across setups
Component flexibility from the technology leader
DaeSung Kim takes over Sales and Service Organization
Fast, flexible, high-resolution
IPC President's Award
Zero DPMO – in every dimension
ASMPT presents central platform for data exchange in electronics manufacturing
Focused on lean structures
The Intelligent Factory Showcase
Maximum uptime with 100-percent transparency
ASM Pacific Technology Is Ranked As The No. 1 Top Assembly Equipment Supplier In 2014 And Earns The Coveted “10 BEST FOCUSED SUPPLIERS OF CHIP MAKING EQUIPMENT” In 2015 As Well As “THE BEST SUPPLIERS OF 2015” Award Once Again
Co-Presentation Of A White Paper With The World’s Leading IDM On Thermo Compression Bonding (TCB) At SEMICON Taiwan
DEK Acquisition To Take SMT Business To A Higher Ground
ASM Pacific Technology (ASMPT) Wins The Coveted “10 BEST” Award And Ranks Among The “Best Suppliers Of 2014” Presented By Vlsiresearch; Achieves “Asia’s Best Companies 2014” Recognition From Financeasia
ASMPT To Acquire Screen Printer Specialist DEK ; SIPLACE And DEK To Become One Team
The Development Of STJ Plant
ASM Response To The Coverage On The Staff Suicide In Shenzhen Factory
ASM Pacific Technology Concludes Acquisition Of The Siemens Electronics Assembly System (SEAS) Business
ASMPT Celebrates Double Win In The “Best Investor Relations Company” And “Asia’s Best CEO (Investor Relations)”Awards
ASMPT To Invest In SMART Factory Software Solutions
ASMPT Has Once Again Ranked Among The 10 Best Semiconductor Equipment Suppliers
ASM Pacific Technology Earns Triple Crown For The Second Year
ASM Pacific Technology Honored 2 Best Supplier Awards For Its Excellence Performance And Long-Standing Partnership
ASM Pacific Technology Expands Its Product Portfolio In Advanced Packaging With New Acquisition
ASM Pacific Technology Opens Second Building And New Innovation Centre
ASM Pacific Technology Acquires Amicra To Enter The Photonics Market
ASMPT Ranked Among The Top 5 In VLSI Customer Satisfaction Survey 2016
ASM Pacific Technology Recognized As 2018 Thomson Reuters Top 100 Global Technology Leaders
ASMPT Recognised For Excellence
ASM Pacific Technology Invests In Its Future With The Opening Of Its R&D Center In Taiwan
ASMPT Awarded The 2015 Supplier Excellence Award
ASM Pacific Technology Celebrates Third Time Win In Technological Achievement
ASMPT Brings Broad Portfolio Of Wafer Level / Panel Level Packaging Capabilities To The Advanced Packaging Marketplace
ASM Pacific Technology Won The “Directors Of The Year Awards 2017”
ASMPT Wins the 2015 Hong Kong Awards for Industries: Technological Achievement Grand Award
ASMPT And Jiujiang Municipal Government Signs Agreement To Build Semiconductor Materials Plant In Jiujiang Economic And Technological Development Zone
ASM Pacific Technology Named “Hong Kong Outstanding Enterprise”
ASMPT Celebrates 40 Years Of Innovation
ASMPT And Tianshui Huatian Electronic Group Signed Letters Of Intent Worth Over US$130 Million At CIIE
New Alliance Between Machine Building And IT For Industries 4.0
ASMPT And SPIL Announce Joint Investment Venture In Molded Interconnect Substrates (“MIS”)
ASMPT Well-Positioned To Leverage High Growth Of Advanced Semiconductor Packaging With NEXX Purchase
ASM Pacific Technology Announces Retirement Of Mr Lee Wai Kwong And Appointment Of Mr Robin Gerard Ng Cher Tat As Chief Executive Officer Effective May 2020
ASM Pacific Technology Experts Discuss Enabling Technologies For Industry 4.0 At SEMICON Taiwan (17 – 20 September 2019)
ASMPT Clinched Grand Award Of The 2019 HKMA Quality Award
ASM Pacific Technology Celebrates Opening Of New Hong Kong Office At Tsing Yi
[Clarification Statement] ASM Pacific Technology
ASMPT CEO Named '"Industrialist Of The Year” At Federation Of Hong Kong Industries’ Awards 2019
ASMPT Signed Letters Of Intent Worth Over US$300 Million At CIIE
ASM Technology Singapore Clinched Singapore Quality Award 2019 For Business Excellence
ASMPT Announces Strategic Joint Venture To Accelerate Its Materials Business | Charting A Bright Course For The Future
ASMPT Collaborates With IBM Research On AI Chip Technology
Renaming Of Business Segment
ASMPT Announces 2020 First Quarter Results | Grasping Opportunities In Crises, Forging Ahead
ASM Pacific Technology and EV Group Join Forces to Enable Industry’s First Ultra Precision Die-to-Wafer Hybrid Bonding Solutions for 3D-IC Heterogeneous Integration
ASMPT Announces 2020 Third Quarter Results | Revenue, Bookings And Profitability For First Nine Months Of 2020 Show Year-On-Year Improvement
ASMPT Announces 2020 Interim Results | Staying Resilient Amid Economic Uncertainty 1H 2020 Group Profitability Improved Year-On-Year
ASM AMICRA Unveils Industry’s First Manufacturing Systems Incorporating X-Celeprint’s MTP Technology For High Volume Heterogeneous Integration Of Ultra-Thin Chips
ASMPT Announces 2021 First Quarter Results | Record Bookings of US$1.01 Billion in Q1 2021 Backed By Broad-Based Demand
ASM Pacific Technology Reaches Milestone With 250th Thermo-Compression Bonding Tool Shipped To Customers
ASM Pacific Technology Announces 2020 Annual Results | Poised For Strong Recovery Q4 2020 YoY 46.3% Bookings Growth
ASM Pacific Technology Reports Robust Nine-Month & Third Quarter 2021 Results | Record Bookings, Revenue and Net Profit for 9M 2021; Bode Well for Full Year 2021 Performance
ASMPT Announces Agreement To Acquire AEi, The Global Automotive Market Leader In Automated Sensor Assembly And Test Equipment
ASM Pacific Technology Announces 2021 Interim Results | Q2 2021 Revenue Exceeds Guidance; Bookings Better Than Expected
ASM Pacific Technology Extends Investment In IoTech, A Flexible Ultra-Fast 3D Printing Start-Up
ASMPT at SEMICON West 2025 Showcasing Advanced Packaging Solutions for AI and High-Performance Computing
Intelligent process optimization along the entire line
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Events
ectc
pcim-europe
3d-systems-summit-2026
semicon-taiwan
semicon-india
semicon-west
in4ma EMS & PCB-Forum 2026
SEMICON SEA 2026
Electronics on the Road BERLIN
SMTA Guadalajara 2026
EFX Stuttgart
productronica India 2026 (South)
Electronics on the Road SALZBURG
NEPCON Thailand 2026
7. Technologieforum Kurtz Ersa
Electronics on the Road HEIDELBERG
SEMICON South East Asia 2026
Electronics on the Road LINDAU
InnoElectro Budapest 2026
EPP Innovationsforum 2026
productronica India 2026 (North)
Global Industrie 2026
EE-Kolleg 2026
EMS Tag Würzburg
KPI-driven decisions in SMT - Why quality pays off
ISES Japan 2025
productronica 2025
AutoSens Europe 2025
SEMICON West 2025
ECOC 2025
Events
All
SEMI
SMT
Nov 18 - 19, 2026 | Event
Electronics on the Road BERLIN
Oct 13 - 15, 2026 | Event
SEMICON West 2026
San Francisco, CA, USA
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