ASMPT Secures Repeat Chip-to-Wafer TCB Orders from Leading Logic Semiconductor Manufacturer

Singapore, 8 June 2026 - ASMPT (HKEX: 0522), the world’s leading provider of integrated hardware and software solutions for semiconductor and electronics manufacturing, announced that it has secured a repeat order for eight Thermo-Compression Bonding (TCB) tools for chip-to-wafer (C2W) applications from a leading global integrated device manufacturer (IDM).

The tools will support the IDM’s production of advanced client and datacentre CPUs, as chiplet-based architectures are increasingly being adopted to address rising performance and integration requirements in the era of heterogeneous computing.

“With advanced packaging requirements extending into client platforms, this latest achievement reinforces our established leadership in TCB chip-to-wafer applications and underscores the strength of our relationship with the customer and their confidence in ASMPT’s ability to support high-volume manufacturing,” said Robin Ng, Group CEO, ASMPT. “This continued momentum in TCB chip-to-wafer solutions runs in tandem with progress in other key growth areas such as TCB for both Chip-to-substrate and High Bandwidth Memory, and Photonics Die Bonders. These position ASMPT strongly as AI ecosystem requirements shift rapidly from training to inference.”

About ASMPT Limited
ASMPT Limited is a leading global supplier of hardware and software solutions for the manufacture of semiconductors and electronics. Headquartered in Singapore, ASMPT's offerings encompass the semiconductor assembly & packaging, and SMT (surface mount technology) industries, ranging from wafer deposition to the various solutions that organise, assemble and package delicate electronic components into a vast range of end-user devices. ASMPT partners with customers very closely, with continuous investment in R&D helping to provide cost-effective, industry-shaping solutions that achieve higher productivity, greater reliability, and enhanced quality. ASMPT is listed on the Stock Exchange of Hong Kong (HKEX stock code: 0522) and is one of the constituent stocks of the HKEX Tech 100 Index, Hang Seng Composite MidCap Index under the Hang Seng Composite Size Indexes, the Hang Seng Composite Information Technology Industry Index under Hang Seng Composite Industry Indexes, the Hang Seng Corporate Sustainability Benchmark Index, and the Hang Seng HK 35 Index. To learn more about ASMPT, please visit us at www.asmpt.com.

For media enquiries:
Global ASMPT Press Office
ASMPT Ltd
Lim Ee Guan
Director, Corporate Communications
E-Mail: eg.lim@asmpt.com

Global ASMPT Semiconductor Solutions Press Office
ASMPT Ltd
Jessica Ho
Semiconductor Solutions
E-Mail: semi_stratmkt@asmpt.com

ASMPT Limited