ASMPT Secures Significant Wins for More than 50
Chip-to-Substrate Thermo-Compression Bonding Tools

Singapore, 29 July 2026– ASMPT (HKEX: 0522), the world’s leading provider of integrated hardware and software solutions for semiconductor and electronics manufacturing, announced new bulk orders for more than 50 of its Chip-to-Substrate (C2S) Thermo-Compression Bonding (TCB) tools for cutting-edge AI computing chips from OSAT customers.

This major milestone affirms ASMPT’s position as the primary supplier and Process of Record (POR) for C2S TCB applications as a powerful enabler for next-generation bonding for larger compound dies. As artificial intelligence and high-performance computing applications continue to advance, ASMPT remains well-positioned to capitalise on the industry growth underpinned by its technological leadership.

"These significant wins underscore the strong trust our customers continue to place in ASMPT as the technology and production partner of choice,” said Robin Ng, Group CEO, ASMPT. “They have confidence in us because we consistently deliver production-proven solutions. Our TCB solution suite spans chip-on-wafer, chip-on-substrate, and HBM applications, and we are the key enabler for the industry’s ambitious advanced packaging roadmaps.”

With growing AI investment and increasing packaging intensity, ASMPT estimates that the TCB Total Addressable Market will expand beyond US$1.6 billion by 2028.

About ASMPT Limited

ASMPT Limited is a leading global supplier of hardware and software solutions for the manufacture of semiconductors and electronics. Headquartered in Singapore, ASMPT's offerings encompass the semiconductor assembly & packaging, and SMT (surface mount technology) industries, ranging from wafer deposition to the various solutions that organise, assemble and package delicate electronic components into a vast range of end-user devices. ASMPT partners with customers very closely, with continuous investment in R&D helping to provide cost-effective, industry-shaping solutions that achieve higher productivity, greater reliability, and enhanced quality.

ASMPT is listed on the Stock Exchange of Hong Kong (HKEX stock code: 0522) and is one of the constituent stocks of the HKEX Tech 100 Index, Hang Seng Composite MidCap Index under the Hang Seng Composite Size Indexes, the Hang Seng Composite Information Technology Industry Index under Hang Seng Composite Industry Indexes, the Hang Seng Corporate Sustainability Benchmark Index, and the Hang Seng HK 35 Index. To learn more about ASMPT, please visit us at www.asmpt.com.

ASMPT Limited