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SIPLACE V placement platform: next-generation performance with improved accuracy, process stability and efficient use of space and materials.
SIPLACE V placement platform: next-generation performance with improved accuracy, process stability and efficient use of space and materials.

SIPLACE V Placement Platform – Performance and Sustainability in Perfect Balance

The new SIPLACE V platform sets new standards in electronics manufacturing. With a real performance increase of up to 30 percent, it combines highest precision with highest placement speed, enabling higher throughput with fewer process interruptions and less material waste.

Advanced linear drives, closed-loop sensor technology, and intelligent placement heads ensure consistent accuracy and high-quality results, even in demanding production environments. By maintaining process stability with a compact footprint, the platform supports resource-efficient manufacturing and helps customers use their factory space and existing infrastructure more effectively.

Seamless compatibility with hardware and software ecosystem from ASMPT SMT Solutions extends the life of the equipment and enhances long-term investment value. With performance reserves for further automation steps and future AI integration, the SIPLACE V platform provides a scalable foundation for efficient, low-waste, and lower-carbon electronics manufacturing.

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