TRY-Engineering – Connecting Students with the Future of AI

In July, ASMPT engineers in Hong Kong supported the IEEE TRY-Engineering on Campus program by hosting a visit for participating students from local universities. Guided by our team, the students explored how AI is integrated into Advanced Packaging and how it drives innovation in electronics manufacturing. The visit provided firsthand insights into real-world engineering challenges and encouraged future talent to see how AI can shape tomorrow’s technologies.